Integration of ICs and MEMS

 

 

 

 

 

 

 

 

 

Prof. Frank Niklaus

Professor at Department of Micro and Nanosystems

KTH Royal Institute of Technology in Stockholm, Sweden

 

 

Abstract

 

The vast majority of commercial MEMS devices, such as accelerometers, gyroscopes and micro-mirror arrays, have to be integrated with ICs to perform useful functions. In this presentation we will review and discuss the traditional as well as emerging innovative approaches for integrating ICs and MEMS. These include approaches based on the hybrid integration of multiple chips (multi-chip solutions) as well as system-on-chip solutions based on wafer-level monolithic

integration and heterogeneous integration technologies. The advantages and disadvantages of the commonly used technologies will be discussed and the implications of the different integration approaches for packaging, testing and final system costs will be reviewed.

CV

 

Prof. Frank Niklaus received his M.Sc. degree in mechanical engineering in 1998 from the Technical University of Munich (TUM), Germany. In 2002 he received his PhD degree in microelectromechanical systems (MEMS) from KTH Royal Institute of Technology in Stockholm, Sweden. Since 2013 he is a Professor with the Department of Micro and Nanosystems at KTH, where he is heading the Micro and Nanofabrication Group. The current research interests of Dr. Niklaus include innovative manufacturing, integration, and packaging technologies for MEMS and nanoelectromechanical systems (NEMS) and graphene-based NEMS devices. He has published more than 160 journal and conference papers and has more than 10 granted patents. Dr. Niklaus is a member of the Young Academy of Europe (YAE) and IEEE Senior Member.


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