Application of Direct Bonding in MEMS

 

 

 

 

 

 

 

 

 

Dr. Sitaram Arkalgud

VP – 3D Applications

Xperi

 

 

Abstract

 

A wide variety of MEMS technologies, covering inertial, environmental, optical and acoustic applications, are commonly used in daily life. The smartphone exemplifies this phenomenon by integrating all of the above into a compact and powerful platform. The IoT revolution, in its turn, promises to drastically increase the usage of both smart and passive sensors as they get adopted into the personal and commercial aspects of our lives. 

One of the common features of MEMS processing is wafer bonding. There are several different bonding technologies in production today, and each has its advantages and disadvantages. Xperi has developed ZiBond (oxide to oxide direct bonding) and DBI (Cu/oxide hybrid bonding) for a variety of 3D stacked applications. In MEMS processing, ZiBond offers low temperature bonding to a variety of substrates, low cost and high bond strength. In addition to the above, DBI promises increased hermeticity and greater architectural flexibility when stacking MEMS on ASIC. Data supporting these attributes will be presented and discussed.  

 

CV

 

Dr. Sitaram Arkalgud is driving the utilization of Ziptronix bonding technologies (ZiBond® and DBI ®) in numerous 3D applications since January 2016. Prior to this role, he led the 3D R&D group as VP, 3D Technology and Portfolio at Invensas. Before joining Xperi (Invensas), he started and led 3D-IC development at SEMATECH, where the focus was on delivering manufacturable process technologies for TSV, Cu-Cu wafer/die bonding and wafer thinning for 3D IC. Previously, Dr Arkalgud worked in a variety of roles spanning R&D and manufacturing in memory and logic technologies at Infineon/Qimonda and Motorola. He is the author of several publications and holds 33 U.S. patents. Sitaram holds a master’s degree and a Ph.D. in materials engineering from Rensselaer Polytechnic Institute in Troy, N.Y., and a bachelor’s degree in metallurgical engineering from Karnataka Regional Engineering College (NIT-K), Surathkal, India. 


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