Epi-Seal Encapsulation for Sensors

 

 

 

 

 

 

 

 

Prof. Dr. Thomas Kenny

Professor of Engineering and

Senior Associate Dean of Engineering for Student Affairs

Stanford University

Abstract

 

There is significant interest in integration of multiple MEMS functionalities into a single compact device. Our group has developed a wafer-scale encapsulation process that provides an ultraclean, stable environment for operation of MEMS timing references, which has been commercialized by SiTime, Inc. In this presentation, I’ll discuss some of the issues associated with incorporation of inertial sensors into this encapsulation process, including design constraints, stiction, pressure, and other issues. 

 

 

CV

 

Dr. Thomas Kenny is currently the Richard W. Weiland Chaired Professor of Mechanical Engineering and Senior Associate Dean for Student Affairs.  His research investigates fundamental issues and applications of micromechanical structures.  Dr. Kenny has been co-founder of 3 startup companies (Cooligy - acquired by Emerson, SiTime - acquired by Megachips, and Applaud Medical - currently in human clinical trials). He served as Program Manager in the Microsystems Technology Office at DARPA from 2006-2010. He was General Chair for Transducers 2015 (just concluded), and has been involved in several other conferences. He has advised more than 50 PhD students and co-authored more than 250 technical publications and more than 50 issued patents.

 

 

 


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