MEMS-based Laser Beam Scanning Technology Platform; Basis for Applications from Displays to 3D Sensors and 3D Printers





Mr. Jari Honkanen

Director of Product Engineering

MicroVision, Inc.




A platform is a group of technologies that are used as a base upon which other applications are developed.  This session will discuss how a single MEMS device combined with Laser Diodes forms a technology platform to support a wide variety of applications and products, from displays to 3D sensors and 3D printers.  This application tour will span display applications from retinal scanning displays to heads-up displays to projection displays, and 3D sensors from mid-range LiDAR to Optical Coherence Tomography, to a variety of other applications such as 3D printers.





Jari Honkanen is Director of Product Engineering at MicroVision.  Jari is responsible for defining and developing new products and applications based on MicroVision's PicoP® scanning technology, a MEMS-based Laser Beam Scanning display and sensing platform, with a focus on integrating display and sensing technology into a single solution. Jari is responsible for bringing engine products with MicroVision’s patented technology to market from product inception through to production. Jari also  works closely with licensees, OEMs and ODMs who are incorporating PicoP scanning technology into their products. During his fourteen year tenure at MicroVision, Jari has held various technical leadership positions, including heading software, electronics platform, and systems engineering teams. Jari has also led technical marketing and applications development for MicroVision giving him a broad insight into the overall technology platform and its applications both from a development and business perspective.  Prior to working at MicroVision, Jari co-founded and led two startup companies, Odin TeleSystems Inc. and DspWorks, Inc.  which focused on open telecommunications and video compression technologies.  Jari holds a Master of Science degree in Technical Physics from Helsinki University of Technology and an MBA from Southern Methodist University.   Jari is an IEEE Senior Member and has four issued patents and several patents pending in the area of MEMS-based Laser Beam Scanning and its applications.


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