A Virtual IDM Pattern for Industrialization of Innovative MEMS Technology


Prof. Xinxin Li

Director of Chinese State Key Lab of Transducer Technology

Shanghai Institute of Microsystem and Information Technology

Chinese Academy of Sciences



The presentation proposes a virtual IDM pattern of fabless designer + semiconductor foundry for MEMS industrialization in China. Based on the pattern, an analog IC foundry compatible MEMS technique, named MIS process, is developed and volume fabricated. With the foundry compatible MIS process implemented from single-side of non-SOI single wafer, various MEMS sensors can be high-yield fabricated that include pressure sensors, accelerometers, TPMS composite sensors, micro flow-meters, infra-red sensors, resonant bio/chemical sensors and microphones. Besides, a liquid-metal refilling TSV technique is developed for low-cost and high-efficiency MEMS packaging. At last, the presentation addresses an intelligent energy-harvesting technique for non-supplied wireless IoT monitoring nodes. 




 Prof. Xinxin Li received the B.S. degree from Tsinghua University, Beijing, and the Ph.D. degree from Fudan University, Shanghai, China. For a long period of time, his research interests have been in the fields of micro/nano sensors and MEMS/NEMS. Before PhD study, he was a Research Engineer with Shenyang Institute of Instrumentation Technology, China. After PhD study, he sequentially worked at Hong Kong University of Science and Technology, Nanyang Technological University, Singapore and Tohoku University, Japan. Since 2001, he has been a Professor with the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences. From 2007 he has been serving as the Director of the State Key Laboratory of Transducer Technology, China. He has invented about 100 patents (more than 10 have been licensed to industry) and published more than 300 papers in refereed journals and conference proceedings (including about 170 SCI journal papers). He is on the Editorial Board of the Journal of Micromechanics and Microengineering. Prof. Xinxin Li served as the Technical Program Committee member for IEEE MEMS 2008 and 2011, IEEE Sensors from 2002 to 2015. From 2014, he has been serving as an International Steering Committee member for the conference of Transducers.

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