Leverage the MEMS Eco-systems at Taiwan via MDL and μSAT

 

 

Prof. Weileun Fang

Distinguished Professor, Power Mechanical Eng., Dept.

National Tsing Hua University (NTHU)

Abstract

 

The mature CMOS fabrication processes are available in many IC foundries. It is cost-effective to leverage the existing CMOS fabrication technologies to implement MEMS devices. On the other hand, the MEMS devices could also add values to the IC industry as the Moore’s law reaching its limit. The CMOS MEMS could play a key role to bridge the gap between the CMOS and MEMS technologies. The CMOS MEMS also offers the advantage of monolithic integration of ICs and micro mechanical components. The Micro Device Laboratory (MDL) at National Tsing Hua University (NTHU) has been working on the development of CMOS-MEMS technologies for near 15 years. Moreover, NTHU further established the micro Sensors and Actuators Technologies Consortium (SAT) in 2013. These two organizations respectively serve as the technologies development center and the networking cluster. In addition to the domestic companies, the foreign MEMS industries are also welcome to leverage the complete semiconductor supply chain at Taiwan via MDL and SAT.

 

CV

 

Prof. Fang received his Ph.D. degree from Carnegie Mellon University (Pittsburgh, PA) in 1995. He is the Fellow of IEEE and IoP. He joined the Power Mechanical Engineering Department at the National Tsing Hua University (Taiwan) in 1996, where he is now a Distinguished Professor as well as a faculty of NEMS Institute. Prof. Fang has published more than 150 SCI journal papers, 270 international conference papers, and 100 patents. He is now the Chief Editor of JMM, the Board Member of IEEE Trans on Device and Materials Reliability, and the Associate Editor of IEEE Sensors J., Sensors and Actuators A., Sensors and Materials, and JM3. He served as the Chief Delegate of Taiwan for the World Micromachine Summit (MMS) in 2008-2012, and the General Chair for MMS 2012. He also served as the TPC (Tech. program committee) of IEEE MEMS’04, ’07, and ’10, the TPC of Transducers’07, and the EPC (Executive program committee) of Transducers’09-’15. He has become the member of ISC (International steering committee) of Transducers from 2009, and will be the General Chair of Transducers’17. He also served as the Asia Regional Program Chair of IEEE Sensors’10, and the TPC Chair of IEEE Sensors’12.


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