MEMS Engineer Forum (MEF) 2024
April 17-18, 2024
KFC Hall, Ryogoku, Tokyo, Japan
Ultra-low-power Brain-inspired Devices and
3D Integration for IoT
Dr. Yasumitsu Orii
Senior Manager of Science & Technology
IBM Research Tokyo
IoTに向けた超低消費電力脳型デバイスと３次元積層デバイス技術
折井 靖光 氏
日本アイ・ビー・エム株式会社
東京基礎研究所 サイエンス＆テクノロジー 部長
Abstract
Ultra low power consumption is strongly required for IoT devices. The brain-inspired device system, which is non-von Neumann computing, is one of attractive method. In this forum, the several brain inspired device system will be introduced. In addition, low cost 3D integration is also key technology to achieve a miniaturization. The vertical integration after stacking process was newly developed and it is extremely low cost 3D integration technology compared with the conventional TSV method.
CV
Yasumitsu Orii received the B.S. in Material Science from the Osaka University, Japan and the Ph.D. from the Osaka University, Japan as well. He is a senior manager of IBM Research Tokyo Science & Technology division and a Senior Technical Staff Member as well as IBM Academy member to lead the three projects which are 3D integration, Optical Interconnection and Brain Inspired Devices. He had been the chair of Technical Program Committee in ICEP 2009-2011 responsible for technical program editing and paper selection. He was the general chair of ICEP-IAAC(IMAPS All Asia Conference) 2012 in Tokyo. He was awarded “IMAPS Fellow” in 2015.
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